Relief plug-in connector and multilayer circuit board
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United States of America Patent
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-
Sep 8, 2015
Grant Date -
Sep 27, 2012
app pub date -
Dec 3, 2010
filing date -
Dec 8, 2009
priority date (Note) -
In Force
status (Latency Note)
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Abstract
A multipole relief plug-in Connector includes contact elements, the contacting sections of which are arranged in height-offset contact area surfaces, and a multilayer circuit board includes several height-offset contact area surfaces accordingly. In combination, the multipole relief plug-in connector contacts the multilayer circuit board and the multilayer circuit board populates the multipole relief plug-in connector. The contact elements of the relief plug-in connector are designed in the contacting section as press-in contacts for pressing into press-in contact receiving portions of the multilayer circuit board. Contact element receiving portions of the multilayer circuit board are arranged in the contact area surfaces of the multilayer circuit board, the contact element receiving portions being designed as press-in contact receiving portions. A production method produces the multilayer circuit board.
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