Solder powder and method of producing solder powder

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 9132514
APP PUB NO 20130244034A1
SERIAL NO

13885505

Stats

ATTORNEY / AGENT: (SPONSORED)

Importance

Loading Importance Indicators... loading....

Abstract

See full text

A solder powder having an average particle diameter of, for example, 0.05 μm or more and less than 3 μm is obtained by a method of producing a solder powder, including the steps of: putting solid or liquid metal, a non-aqueous solvent, and crushing balls having a diameter of 0.05 mm to 5 mm into a container to obtain a mixture; heating the mixture to 150° C. or higher and stirring the mixture; separating the crushing balls from the mixture after the stirring to obtain a mixture of the solder powder and the non-aqueous solvent; and performing solid-liquid separation on the mixture of the solder powder and the non-aqueous solvent to obtain a solder powder.

Loading the Abstract Image... loading....

First Claim

See full text

Family

Loading Family data... loading....

Patent Owner(s)

Patent OwnerAddress
DOWA HOLDINGS CO LTD4-14-1 SOTOKANDA CHIYODA-KU TOKYO 101-0021

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Ishikawa, Yuichi Tokyo, JP 103 1788

Cited Art Landscape

Load Citation

Patent Citation Ranking

Forward Cite Landscape

Load Citation

Maintenance Fees

Fee Large entity fee small entity fee micro entity fee due date
11.5 Year Payment $7400.00 $3700.00 $1850.00 Mar 15, 2027
Fee Large entity fee small entity fee micro entity fee
Surcharge - 11.5 year - Late payment within 6 months $160.00 $80.00 $40.00
Surcharge after expiration - Late payment is unavoidable $700.00 $350.00 $175.00
Surcharge after expiration - Late payment is unintentional $1,640.00 $820.00 $410.00