Electroplating composition for coating a substrate surface with a metal
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United States of America Patent
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Sep 15, 2015
Grant Date -
Jul 23, 2009
app pub date -
Sep 20, 2006
filing date -
Sep 20, 2005
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Abstract
The object of the present invention is an electroplating composition intended in particular for coating a copper-diffusion barrier layer with a seed layer, This composition comprises a source of copper ions, in a concentration of between 0.4 and 40mM; at least one copper complexing agent chosen from the group of primary aliphatic amines, secondary aliphatic amines, tertiary aliphatic amines, aromatic amines, nitrogen heterocycles and oximes; the copper/complexing agent(s) molar ratio being between 0.1 and 2.5, preferably between 0.3 and 1.3; and the pH of the composition being less than 7, preferably between 3.5 and 6.5.
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