Cylinder plating method and device

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United States of America Patent

PATENT NO 9133561
APP PUB NO 20130161196A1
SERIAL NO

13820641

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Abstract

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Provided are a plating method and a plating apparatus for a cylinder, which are capable of forming a plating layer having a uniform thickness in a technology of plating a cylinder, effectively preventing current concentration in cylinder end portions when being combined with a plating technology using divided insoluble electrodes, and performing plating with a more uniform thickness over the full length of a cylinder without generating defects such as rashes and pits irrespective of the size of the cylinder. The insoluble electrode has a shape in which a lower part thereof is curved inward, and is capable of rotating about an upper end thereof. Further, a thickness of a plating layer on an outer peripheral surface of the cylinder is adjusted by controlling an interval of closeness to the cylinder.

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Patent Owner(s)

Patent OwnerAddress
THINK LABORATORY CO LTD1201-11 TAKADA KASHIWA-SHI CHIBA 2778525

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Shigeta, Tatsuo Kashiwa, JP 54 317

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