Method of creating alignment/centering guides for small diameter, high density through-wafer via die stacking

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United States of America Patent

PATENT NO 9136259
APP PUB NO 20090255705A1
SERIAL NO

12101776

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Abstract

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A method is provided for forming a die stack. The method includes forming a plurality of through-wafer vias and a first plurality of alignment features in a first die. A second plurality of alignment features is formed in a second die, and the first die is stacked on the second die such that the first plurality of alignment features engage the second plurality of alignment features. A method of manufacturing a die stack is also provided that includes forming a plurality of through-wafer vias on a first die, forming a plurality of recesses on a first die, and forming a plurality of protrusions on a second die. A die stack and a system are also provided.

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Patent Owner(s)

  • MICRON TECHNOLOGY, INC.

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Pratt, Dave Meridian, US 20 428

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