Printed matter manufacturing method, printed matter manufacturing device, and printed matter

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United States of America Patent

PATENT NO 9139093
APP PUB NO 20120142509A1
SERIAL NO

13301860

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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The printed matter manufacturing method includes the steps of providing a printed layer in a predetermined pattern on a substrate, and providing an open part penetrating through the substrate and the printed layer in an open part formation region. The printed matter manufacturing method has a step of providing a buffer layer for mitigating a shock imparted to the printed layer when the open part is provided, so that the buffer layer contacts the printed layer in at least a portion of a periphery of the open part formation region.

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Patent Owner(s)

  • SEIKO EPSON CORPORATION

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Momose, Seigo Nagano, JP 13 32
Sugai, Keigo Nagano, JP 50 50

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