Method of manufacturing a fabric type circuit board
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United States of America Patent
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Sep 22, 2015
Grant Date -
Apr 11, 2013
app pub date -
Jul 18, 2012
filing date -
Oct 5, 2011
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A fabric type circuit board in which a conductive pattern is provided both faces of fabrics and a method of manufacturing the same. A fabric type circuit board includes fabrics and a conductive pattern in which extension units folded from one side of the fabrics to another side of the fabrics are formed, wherein the conductive pattern is formed using at least one of a copper film transfer printing scheme, printing, etching, embroidery, and sewing. A method of manufacturing a fabric type circuit board includes forming a conductive pattern, having extension units formed therein, on fabrics, cutting a part of the fabrics on which the conductive pattern is formed, and forming contact surfaces by folding the extension units from one side of the fabrics to another side of the fabrics.
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