Methods and systems for dissipating heat in optical communications modules

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United States of America Patent

PATENT NO 9146368
APP PUB NO 20140063743A1
SERIAL NO

13600334

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Abstract

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Heat dissipation resources are allocated in an optical communications module based on the sensitivity of electrical and optoelectronic components of the module to temperature. Components that have a higher sensitivity to temperature are allocated a greater proportion of available heat dissipation resources than components that have a lower sensitivity to temperature. In addition, heat dissipation resources that are allocated to components that have different sensitivities to temperature are thermally decoupled from one another.

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Patent Owner(s)

  • AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Chan, Seng-Kum Santa Clara, US 37 390
Meadowcroft, David J K San Jose, US 27 142

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