Integrated circuit packaging system with fiber-less substrate and method of manufacture thereof
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United States of America Patent
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Sep 29, 2015
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Dec 20, 2013
filing date -
Dec 20, 2013
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Abstract
An integrated circuit packaging system including: a fiber-less organic substrate including: a first dielectric layer, a first metal layer on the first dielectric layer, a second dielectric layer on the first dielectric layer and the first metal layer, and an interconnect via plated on the first metal layer and the second dielectric layer; an integrated circuit mounted over the second dielectric layer; and an integrated circuit interconnect between the integrated circuit and the interconnect via.
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