Semiconductor power converter and method of manufacturing the same
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United States of America Patent
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Sep 29, 2015
Grant Date -
May 1, 2014
app pub date -
Sep 12, 2013
filing date -
Oct 31, 2012
priority date (Note) -
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Abstract
According to one embodiment, a semiconductor power converter includes first and second electrical conductors opposed to each other, first and second semiconductor elements joined to a first joint surface of the first electrical conductor, first and second convex electrical conductors joined to the first and second semiconductor elements, a junction joined to the first and second convex electrical conductors and a second joint surface of the second electrical conductor, power terminals, signal terminals, and an envelope sealing the constituent members. The envelope includes a flat bottom surface which extends perpendicular to the semiconductor elements and in which first and second bottom surfaces of the electrical conductors are exposed.
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