High thermal conductivity and low degradation die attach with dual adhesive

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 9147813
APP PUB NO 20130062655A1
SERIAL NO

13228612

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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A package for a light source, a semiconductor device, and methods of manufacturing the same are disclosed. In particular, a Light Emitting Diode (LED) dice is attached to a bonding pad of the light source package by two discrete types of different adhesives. One of the adhesives may be curable under exposure to Ultraviolet (UV) light and the other adhesive may be cured under thermal radiation, but is stable when exposed to UV light.

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Patent Owner(s)

  • AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Chan, Bit Tie Pulau Pinang, MY 6 26
Ng, Keat Chuan Penang, MY 40 322
Tan, Kheng Leng Gelugor, MY 54 1177

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