Method for manufacturing acoustic wave device

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United States of America Patent

PATENT NO 9148107
APP PUB NO 20120198672A1
SERIAL NO

13362743

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Abstract

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A method for manufacturing an acoustic wave device includes: bonding a piezoelectric substrate to a first surface of a first support substrate; thinning the piezoelectric substrate after the bonding to thus form a piezoelectric layer; forming a first electrode on a first surface of the piezoelectric layer; forming holes in the first support substrate located below the first electrode; and bonding a second support substrate to a second surface of the first support substrate opposite to the first surface after the forming of holes.

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Patent Owner(s)

  • TAIYO YUDEN CO., LTD.

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Iwaki, Masafumi Tokyo, JP 77 1198
Nishihara, Tokihiro Tokyo, JP 120 1661
Ueda, Masanori Tokyo, JP 165 2676

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