Top port surface mount MEMS microphone
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United States of America Patent
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Sep 29, 2015
Issued Date -
N/A
app pub date -
Apr 22, 2014
filing date -
Nov 28, 2000
priority date (Note) -
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status (Latency Note)
Importance
Abstract
A top port, surface mount package for a micro-electro-mechanical system (MEMS) microphone die is disclosed. The surface mount package features a substrate with metal pads for surface mounting the package to a device's printed circuit board and for making electrical connections between the microphone package and the device's circuit board. The surface mount microphone package has a cover with an acoustic port, and the MEMS microphone die is substrate-mounted and acoustically coupled to the acoustic port. The substrate and the cover are joined together to form the MEMS microphone, and the substrate and cover cooperate to form an acoustic chamber for the substrate-mounted MEMS microphone die.
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