Methods of manufacture of bottom port surface mount MEMS microphones
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United States of America Patent
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Oct 6, 2015
Grant Date -
N/A
app pub date -
Jan 14, 2014
filing date -
Nov 28, 2000
priority date (Note) -
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Abstract
Methods for manufacturing multiple bottom port, surface mount microphones, each containing a micro-electro-mechanical system (MEMS) microphone die, are disclosed. Each surface mount microphone features a substrate with metal pads for surface mounting the package to a device's printed circuit board and for making electrical connections between the microphone package and the device's circuit board. The surface mount microphones are manufactured from a panel of unsingulated substrates, each substrate having an acoustic port, and each MEMS microphone die is substrate-mounted and acoustically coupled to its respective acoustic port. Individual covers are joined to the panel of unsingulated substrates, and each individual substrate and cover pair cooperates to form an acoustic chamber for its respective MEMS microphone die. The completed panel is singulated to form individual MEMS microphones.
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