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• 15 United States
• 10 France
• 8 Japan
• 7 China
• 5 Korea
• 2 Other

Patent Owner(s)

• FUJIMI INCORPORATED

International Classification(s)

• B24B:MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR PO....
• C09K:MATERIALS FOR APPLICATIONS NOT OTHERWISE PROVIDED ....
• H01L:SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICE....
• C03C:CHEMICAL COMPOSITION OF GLASSES, GLAZES, OR VITREO....
• C09G:POLISHING COMPOSITIONS OTHER THAN FRENCH POLISH; S....
• C23F:NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM S....
• B44C:PRODUCING DECORATIVE EFFECTS

• [Classification Symbol]

• [Patents Count]

Inventor(s)

Inventor Name	Address	# of filed Patents	Total Citations
Fukuda, Kanako	Kiyosu, JP	16	40
Miller, Anne	Tualatin, US	14	432
Saito, Chiaki	Kiyosu, JP	18	169

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Maintenance Fees

Fee	Large entity fee	small entity fee	micro entity fee	due date
11.5 Year Payment	$7400.00	$3700.00	$1850.00	Apr 6, 2027

Fee	Large entity fee	small entity fee	micro entity fee
Surcharge - 11.5 year - Late payment within 6 months	$160.00	$80.00	$40.00
Surcharge after expiration - Late payment is unavoidable	$700.00	$350.00	$175.00
Surcharge after expiration - Late payment is unintentional	$1,640.00	$820.00	$410.00

DATE PUBLISHED	PUBLICATION/PATENT NO.	PUBLICATION TYPE
October 06, 2015	US,9150758,B2   US9150758B2	GRANTED PATENT AS SECOND PUBLICATION
May 22, 2014	US,20140141612,A1   US20140141612A1	FIRST PUBLISHED PATENT APPLICATION

Full Text

US Patent No: 9150758

Polishing composition, polishing method using same, and method for producing semiconductor device

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