Chemical mechanical polishing composition for polishing silicon wafers and related methods

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United States of America Patent

PATENT NO 9150759
APP PUB NO 20150093900A1
SERIAL NO

14039390

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Abstract

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A chemical mechanical polishing composition for polishing silicon wafers is provided, containing: water, optionally, an abrasive; a cation according to formula (I); piperazine or a piperazine derivative according to formula (II); and, a quaternary ammonium compound; wherein the chemical mechanical polishing composition exhibits a pH of 9 to 12. Also provided are methods of making and using the chemical mechanical polishing composition.

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Patent Owner(s)

Patent OwnerAddress
ROHM AND HAAS ELECTRONIC MATERIALS CMP HOLDINGS INC451 BELLEVUE ROAD NEWARK DE 19713
NITTA HAAS INCORPORATEDOSAKA-SHI OSAKA 556-0022

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Cook, Lee Melbourne Atglen, US 59 1870
Haba, Shinichi Kyoto, JP 4 4
Itai, Yasuyuki Kyoto, JP 8 28
Kawai, Naoko Kyoto, JP 2 19
Matsushita, Takayuki Kyoto, JP 17 134
Nakano, Hiroyuki Kyoto, JP 217 2072
Nakashima, Sakiko Kyoto, JP 1 3
Ota, Yoshiharu Kyoto, JP 12 38
Penta, Naresh Kumar Newark, US 15 18
Teramoto, Masashi Kyoto, JP 11 69
Toda, Tomoyuki Kyoto, JP 4 8
Yoshida, Koichi Kyoto, JP 91 914

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