VLSI hot-spot minimization using nanotubes

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United States of America Patent

PATENT NO 9151550
APP PUB NO 20100328899A1
SERIAL NO

12873899

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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The invention relates to a semiconductive device comprising a die with at least one defined hot-spot area lying in a plane on the die and a cooling structure comprising nanotubes such as carbon nanotubes extending in a plane different than the plane of the hot-spot area and outwardly from the plane of the hot-spot area. The nanotubes are operatively associated with the hot-spot area to decrease any temperature gradient between the hot-spot area and at least one other area on the die defined by a temperature lower than the hot-spot area. A matrix material comprising a second heat conducting material substantially surrounds the nanotubes and is operatively associated with and in heat conducting relation with the other area on the die defined by a temperature lower than the hot-spot area.

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Patent Owner(s)

  • INTERNATIONAL BUSINESS MACHINES CORPORATION

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Dimitrakopoulos, Christos Dimitrios Baldwin Place, US 26 910
Georgiou, Christos John Scarsdale, US 24 988

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