Method of forming a planar surface for a semiconductor device structure, and related methods of forming a semiconductor device structure

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United States of America Patent

PATENT NO 9153451
APP PUB NO 20140162455A1
SERIAL NO

13712635

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Abstract

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A method of forming a planar surface for a semiconductor device structure. The method comprises forming a particle film comprising a plurality of discrete particles on a non-planar surface of a semiconductor device structure. The semiconductor device structure is subjected to at least one chemical-mechanical polishing process after forming the particle film on the non-planar surface of the semiconductor device structure. Methods of forming a semiconductor device structure are also described.

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Patent Owner(s)

  • MICRON TECHNOLOGY, INC.

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Carswell, Andrew Dennis Watson Boise, US 3 20
Huang, Wayne Hai-Wei Boise, US 1 4
Kondoju, Siddartha Boise, US 4 32
Lu, Jin Boise, US 109 3210
Ramakrishnan, Suresh Boise, US 4 57
Sakai, Kozaburo Boise, US 2 17
Varghese, Sony Boise, US 57 350
Zagrebelny, Andrey V Eagan, US 10 49

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