Microstructured hot stamping die
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United States of America Patent
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Oct 6, 2015
Grant Date -
Jun 26, 2014
app pub date -
Jun 27, 2012
filing date -
Aug 2, 2011
priority date (Note) -
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Abstract
A stamping die for hot stamping a material includes a profiled stamping surface, wherein the stamping die includes at least one thermally insulating substrate, on which an electrically conductive structure having a heating resistor is arranged, and wherein the electrically conductive structure is covered by an electrically insulating film. The surface of the electrically insulating film includes the profiled stamping surface and the electrically insulating film covers at least the heating resistor such that the electrically insulating film with the stamping surface can be electrically heated by the heating resistor. A method for hot stamping a material using such a stamping die includes heating the resistor to a temperature between 100° C. and 800° C.
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