Flexible packaging substrate and fabricating method thereof and packaging method for OLED using the same
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United States of America Patent
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Oct 13, 2015
Grant Date -
Jan 15, 2015
app pub date -
Dec 19, 2013
filing date -
Jul 4, 2013
priority date (Note) -
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Abstract
Provided herein is a flexible packaging substrate, comprising a first polymer layer; a metal foil layer disposed on the first polymer layer; a second polymer layer disposed on the metal foil layer; and wherein the surface area of the metal foil layer is larger than those of both the first and the second polymer layer. Also provided are a fabricating method for the same and a method for packaging an organic electroluminescent device using the same. The flexible packaging substrate according to the present invention is able to prevent oxygen and moisture from permeating effectively, allowing the service life of the packaged device prolonged. Additionally, the fabrication according to the examples of the present invention was performed through simple processes, and thereby the packaging process was simplified and the packaging performance was improved.
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