Induction-coupled clock distribution for an integrated circuit
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United States of America Patent
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Oct 27, 2015
Grant Date -
Jul 31, 2014
app pub date -
Sep 13, 2013
filing date -
Jan 29, 2013
priority date (Note) -
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Abstract
An integrated circuit package including an induction-coupled clock distribution system is disclosed. An exemplary embodiment of the disclosure includes a transmission module coupled to a main clock line, a clock reception module coupled to the transmission module, the clock reception module including a clock output line, and an electronic circuit coupled to the clock output line of the clock reception module, the electronic circuit including at least one clocked element and configured to operate synchronously with a clocking signal received through the clock output line of the clock reception module. The transmission module may be disposed on the supporting case of the IC package, and the electronic circuit and the clock reception module may be disposed on the semiconductor die of the IC package.
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