Packaging substrate, method for manufacturing same, and chip packaging structure having same
Number of patents in Portfolio can not be more than 2000
United States of America Patent
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Oct 27, 2015
Grant Date -
Jul 3, 2014
app pub date -
Dec 5, 2013
filing date -
Dec 28, 2012
priority date (Note) -
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Abstract
A packaging substrate includes a circuit board, a number of first conductive posts, and a number of second conductive posts. The circuit board includes a first base and a first conductive pattern layer formed on a first surface of the first base. The first conductive posts extend from and are electrically connected to the first conductive pattern layer. The second conductive posts extend from and are electrically connected to the first conductive pattern layer. The height of each of the second conductive posts are larger than that of each of the first conductive posts.
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