Low profile cryopump

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United States of America Patent

PATENT NO 9174144
APP PUB NO 20130276466A1
SERIAL NO

13451711

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ATTORNEY / AGENT: (SPONSORED)

Importance

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Abstract

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Faster cool down time is achieved in a low profile cryopump by having heat transferred directly from the inlet louver to the first stage heat station through one or more tapered thermal busses, and by obviating the need of a thermal shield over the second stage cylinder of the expander by having second stage cryopanels that form a nested tent like structure, at least one of which, extends over the cylinder.

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Patent Owner(s)

Patent OwnerAddress
SUMITOMO (SHI) CRYOGENICS OF AMERICA INC1833 VULTEE STREET ALLENTOWN PA 18103-4783

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Longsworth, Ralph Allentown, US 16 102

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