Substrate cutting apparatus and method for cutting substrate using the same
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United States of America Patent
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Nov 3, 2015
Grant Date -
Mar 3, 2011
app pub date -
Jul 7, 2010
filing date -
Sep 2, 2009
priority date (Note) -
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Abstract
A substrate cutting apparatus includes a stage configured to support a substrate, a first laser generator configured to emit a first laser beam toward the substrate, the first laser beam being a short-pulse laser beam, and a beam swing unit disposed on a beam path of the first laser beam, the beam swing unit being configured to swing the first laser beam in a predetermined light irradiating section on the substrate, the light irradiating section on the substrate including at least one of a curved line section and a straight line section.
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