Die assembly on thin dielectric sheet
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United States of America Patent
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Nov 3, 2015
Grant Date -
Apr 2, 2015
app pub date -
Sep 30, 2013
filing date -
Sep 30, 2013
priority date (Note) -
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Abstract
A die assembly formed on a thin dielectric sheet is described. In one example, a first and a second die have interconnect areas. A dielectric sheet, such as glass, silicon, or oxidized metal is applied over the interconnect areas of dies. Conductive vias are formed in the dielectric sheet to connect with pads of the interconnect areas. A build-up layer includes routing to connect pads of the first die interconnect area to pads of the second die interconnect area through the conductive vias and a cover is applied over the dies, the dielectric sheet, and the build-up layer.
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