Method and apparatus for thermally processing plastic discs, in particular mould wafers

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 9177845
APP PUB NO 20120107757A1
SERIAL NO

13058816

Stats

ATTORNEY / AGENT: (SPONSORED)

Importance

Loading Importance Indicators... loading....

Abstract

See full text

A method and apparatus for thermally processing mold wafers The method comprises: clamping a mold wafer at a first temperature on a first clamping device, the first temperature being below the hardening temperature of the plastic of the mold wafer; heating the mold wafer to a second temperature, which is higher than the first temperature and is above the hardening temperature; ending the clamping on the first clamping device and transporting the mold wafer heated to the second temperature to a second clamping device substantially contactlessly; clamping the heated mold wafer on the second clamping device; cooling the mold wafer down to a third temperature, which is lower than the second temperature and is below the hardening temperature; and ending the clamping on the second clamping device.

Loading the Abstract Image... loading....

First Claim

See full text

Family

Loading Family data... loading....

Patent Owner(s)

Patent OwnerAddress
ERS ELECTRONIC GMBH82110 GERMERING

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Reitinger, Erich Emmering, DE 5 247

Cited Art Landscape

Load Citation

Patent Citation Ranking

Forward Cite Landscape

Load Citation

Maintenance Fees

Fee Large entity fee small entity fee micro entity fee due date
11.5 Year Payment $7400.00 $3700.00 $1850.00 May 3, 2027
Fee Large entity fee small entity fee micro entity fee
Surcharge - 11.5 year - Late payment within 6 months $160.00 $80.00 $40.00
Surcharge after expiration - Late payment is unavoidable $700.00 $350.00 $175.00
Surcharge after expiration - Late payment is unintentional $1,640.00 $820.00 $410.00