Implementing microscale thermoacoustic heat and power control for processors and 3D chipstacks

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United States of America Patent

PATENT NO 9177889
APP PUB NO 20140083094A1
SERIAL NO

13624051

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Abstract

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A method and apparatus are provided for implementing microscale thermoacoustic heat and power control for processors and three dimensional (3D) chip stacks. A thermoacoustic heat engine is integrated with a 3D chip-stack and high power processors. The thermoacoustic heat engine is used in cooperation with a heat sink associated with the 3D chip-stack. Predefined connecting layers connect the 3D chip-stack to a cooling end of a thermoacoustic stack of the thermoacoustic heat engine, allowing the cooled end of the resonator to maintain temperature within the 3D chip-stack and to increase the efficiency of the heat sink.

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Patent Owner(s)

Patent OwnerAddress
INTERNATIONAL BUSINESS MACHINES CORPORATIONNEW ORCHARD ROAD ARMONK NY 10504

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Elison, Bret P Rochester, US 23 96
Mann, Phillip V Rochester, US 92 271
Sinha, Arvind K Rochester, US 91 497

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