Semiconductor device with stacked semiconductor chips

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United States of America Patent

PATENT NO 9177941
APP PUB NO 20140091479A1
SERIAL NO

14094941

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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A semiconductor chip 109 is mounted on a substrate 100, first wire group 120 and a second wire group 118 having a wire length shorter than the first wire group are provided so as to connect the substrate 100 and the semiconductor chip 109 to each other, and a sealing resin 307 is injected from the first wire group 120 toward the second wire group 118 so as to form a sealer 401 covering the semiconductor chip 109, the first wire group 120, and the second wire group 118.

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Patent Owner(s)

  • ELPIDA MEMORY, INC.;LONGITUDE SEMICONDUCTOR S.A.R.L.

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Handa, Naohiro Tokyo, JP 2 4

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