First and second microstrip networks stacked in an inverted arrangement to each other using an integrated support and shielding structure
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United States of America Patent
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Nov 3, 2015
Issued Date -
N/A
app pub date -
Mar 14, 2013
filing date -
Dec 6, 2012
priority date (Note) -
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Abstract
An assembly includes at least one first microstrip network having at least one first transmission line disposed on a first surface of a first dielectric layer including a first ground plane disposed on a second surface of the dielectric layer. At least one second microstrip network includes at least one second transmission line disposed on a first surface of a second dielectric layer, the second dielectric layer including a second ground plane disposed on a second surface of the second dielectric layer. The at least one second microstrip network is inverted relative to the at least one first microstrip network. At least one integrated support and shielding (ISS) structure is disposed between the second and the first microstrip network. The ISS structure includes a first cavity accommodating the first microstrip network and a second cavity accommodating the second microstrip network. The cavities are configured in accordance with RF performance criterions.
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