Adhesive resin compositions, and laminates and flexible printed wiring boards using same
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United States of America Patent
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Nov 10, 2015
Grant Date -
Dec 15, 2011
app pub date -
Jan 18, 2010
filing date -
Feb 24, 2009
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
Provided are an adhesive resin composition that is halogen-free, has good adhesiveness, solder heat resistance, and flame retardancy, and has good flow characteristics, and a laminate and a flexible printed wiring board using the same. The adhesive resin composition contains a phosphorus-containing epoxy resin and/or a phosphorus-containing phenoxy resin, a phosphorus-containing polyester resin having a weight-average molecular weight of more than 20,000 and 150,000 or less, another thermoplastic resin, and a curing agent. The adhesive resin composition preferably further contains a benzoxazine compound. Preferably, substantially no inorganic filler is mixed in the adhesive resin composition.
First Claim
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International Classification(s)
- C09J:ADHESIVES; ADHESIVE PROCESSES IN GENERAL
- C08G:MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN B....
- C08L:COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- B32B:LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA....
- H05K:PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAIL....
- C08K:USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUB....
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