Multi-layer interconnection structure

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United States of America Patent

PATENT NO 9184063
APP PUB NO 20130292160A1
SERIAL NO

13939801

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Abstract

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Provided are a multi-layer interconnection structure and a manufacturing method thereof. The multi-layer interconnection structure includes a substrate; a first wiring on the substrate; an interlayer insulation layer on the first wiring; a second wiring on the interlayer insulation layer; and a via contact including at least one conductive filament penetrating through the interlayer insulation layer between the second wiring and the first wiring to be electrically connected to the first wiring and the second wiring.

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Patent Owner(s)

  • ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Koo, Jae Bon Daejeon, KR 128 895
Noh, Yong-Young Daejeon, KR 15 69
Yang, Yong Suk Daejeon, KR 43 298
You, In-Kyu Daejeon, KR 45 175

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