Semiconductor device packages including thermally insulating materials and methods of making and using such semiconductor packages
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United States of America Patent
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Nov 10, 2015
Grant Date -
Nov 6, 2014
app pub date -
Jul 18, 2014
filing date -
Jul 12, 2012
priority date (Note) -
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Abstract
Semiconductor devices may include a first semiconductor die comprising a heat-generating region located at a periphery thereof. A second semiconductor die is attached to the first semiconductor die. At least a portion of the heat-generating region is located laterally outside a footprint of the second semiconductor die. A thermally insulating material is located on a side surface of the second semiconductor die. Methods of forming semiconductor devices may involve attaching a second semiconductor die to a first semiconductor die. The first semiconductor die includes a heat-generating region at a periphery thereof. At least a portion of the heat-generating region is located laterally outside a footprint of the second semiconductor die. A thermally insulating material is located on a side surface of the second semiconductor die.
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