Semiconductor device with an interlocking wire bond

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 9184149
APP PUB NO 20150228608A1
SERIAL NO

14179397

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Abstract

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In one embodiment, a semiconductor device having a die attach pad, an interlocking wire bond, a semiconductor die and an adhesive material is disclosed. The adhesive material may be configured to adjoin the semiconductor die and the die attach pad. A portion of the interlocking wire bond may be submerged within the adhesive material. In another embodiment, a device having a semiconductor die, a die attach glue and a die attach pad is disclosed. The device may comprise an interlock bonding structure submerged within the adhesive material. In yet another embodiment, a light-emitting device comprising an interlock structure is disclosed.

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Patent Owner(s)

  • AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Ng, Keat Chuan Penang, MY 40 322
Ong, Kiam Soon Penang, MY 8 130
Tan, Kheng Leng Penang, MY 54 1176

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