Electronic device with bimetallic interface element for wire bonding

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United States of America Patent

PATENT NO 9184150
APP PUB NO 20150076712A1
SERIAL NO

14487559

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Abstract

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An electronic device includes a chip with an integrated electronic component and a terminal made of a first metal material. The device further includes a lead made of a second metal material different from the first metal material. A bonding wire made of a selected one of the first and second metal materials has opposite ends coupled with the terminal and the lead. An interface element having a first layer made of a selected one of the first and second metal materials and a second layer made of an unselected one of the first and second metal materials has the first layer coupled with the bonding wire and the second layer coupled with a component, wherein the component is ether the terminal or the lead.

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Patent Owner(s)

  • STMICROELECTRONICS S.R.L.

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Cristaldi, Giuseppe Sicily, IT 2 1

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