Plating apparatus, nozzle-anode unit, method of manufacturing plated member, and fixing apparatus for member to be plated
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Nov 17, 2015
Grant Date -
Jul 10, 2014
app pub date -
Jan 14, 2014
filing date -
Nov 1, 2012
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A plating apparatus includes a plating bath, an insoluble anode located in the plating bath, a plating electric power supply being capable of applying a voltage between the insoluble anode and the member to be plated, an anode-displacement mechanism being capable of moving the insoluble anode in the plating bath and of holding the insoluble anode at a predetermined position in the plating bath, and a controller having an anode-position controller being capable of generating a control signal for controlling an action of the anode-displacement mechanism and of outputting the control signal to the anode-displacement mechanism.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Advertisement
Advertisement
Advertisement
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully