Flip-chip assembly comprising an array of vertical cavity surface emitting lasers (VCSELSs), and an optical transmitter assembly that incorporates the flip-chip assembly
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United States of America Patent
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Nov 17, 2015
Grant Date -
Oct 30, 2014
app pub date -
Jul 11, 2014
filing date -
Aug 31, 2010
priority date (Note) -
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Abstract
A plurality of flip-chips, each having a plurality of optoelectronic elements formed therein, are flip-chip mounted on a top surface of a substrate that is comprised of a material that is transparent to the operating wavelength of the light produced by optoelectronic elements of the flip-chips. The combination of flip-chips comprises an array of precisely-aligned optoelectronic elements. When the substrate comprising the array of optoelectronic elements is mounted on a PCB, electrical contact pads disposed on the bottom and/or top surface of the substrate are in contact with the respective electrical contact pads disposed on the top surface of the PCB to electrically interconnect the PCB with the flip-chips. Mating features on the substrate that have been precisely positioned by semiconductor fabrication steps are disposed for mating with respective mating features of a multi-optical fiber ferrule device that have been precisely formed in the ferrule device at precise locations.
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