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• 15 United States
• 10 France
• 8 Japan
• 7 China
• 5 Korea
• 2 Other

Patent Owner(s)

Patent Owner	Address
TAIYO HOLDINGS CO LTD	388 OAZA OHKURA RANZAN-MACHI HIKI-GUN SAITAMA 355-0222

International Classification(s)

• G03F:PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNE....
• H05K:PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAIL....

• [Classification Symbol]

• [Patents Count]

Inventor(s)

Inventor Name	Address	# of filed Patents	Total Citations
Arima, Masao	Kawagoe, JP	32	248
Endo, Arata	Tsurugashima, JP	7	24
Minegishi, Shoji	Hiki-gun, JP	13	58

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Maintenance Fees

Fee	Large entity fee	small entity fee	micro entity fee	due date
11.5 Year Payment	$7400.00	$3700.00	$1850.00	May 17, 2027

Fee	Large entity fee	small entity fee	micro entity fee
Surcharge - 11.5 year - Late payment within 6 months	$160.00	$80.00	$40.00
Surcharge after expiration - Late payment is unavoidable	$700.00	$350.00	$175.00
Surcharge after expiration - Late payment is unintentional	$1,640.00	$820.00	$410.00

DATE PUBLISHED	PUBLICATION/PATENT NO.	PUBLICATION TYPE
November 17, 2015	US,9188871,B2   US9188871B2	GRANTED PATENT AS SECOND PUBLICATION
February 06, 2014	US,20140034371,A1   US20140034371A1	FIRST PUBLISHED PATENT APPLICATION

Full Text

US Patent No: 9188871

Pattern forming method, alkali-developable thermosetting resin composition, printed circuit board and manufacturing method thereof

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