Determining at least one of alignment and bond line thickness between an optical component and a mounting surface
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United States of America Patent
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Nov 17, 2015
Grant Date -
Oct 31, 2013
app pub date -
Mar 12, 2013
filing date -
Apr 25, 2012
priority date (Note) -
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status (Latency Note)
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Abstract
A bottom surface of an optical component is bonded to a mounting surface. The bottom surface includes a first opaque feature and the mounting surface includes a second opaque feature. The first and second opaque features are hidden between the bottom surface and the mounting surface after the bonding. An infrared image is obtained through a top surface of the optical component that is opposed to the bottom surface. The infrared image includes a view of a region proximate first and second opaque features. One or more of an optical alignment and a bond line thickness between the optical component and the mounting surface is determined via the infrared image.
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