Method and apparatus for slice and view sample imaging
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United States of America Patent
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Nov 17, 2015
Grant Date -
Dec 3, 2015
app pub date -
May 30, 2014
filing date -
May 30, 2014
priority date (Note) -
Withdrawn
status (Latency Note)
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Abstract
Methods, apparatuses, and systems for slice and view processing of samples with dual beam systems. The slice and view processing includes exposing a vertical wall of a trench formed in a sample surface; capturing a first image of the wall by interrogating the wall with an interrogating beam while the wall is at a first orientation relative to the beam; capturing a second image of the wall by interrogating the wall with the beam while the wall is at a second orientation relative to the beam, wherein first distances in the first image between a reference point and surface points on the wall are different than second distances in the second image between the reference point and the surface points; determining elevations of the surface points using the first distances and the second distances; and fitting a curve to topography of the wall using the elevations.
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