System and method for controlling plasma with an adjustable coupling to ground circuit

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United States of America Patent

PATENT NO 9190302
APP PUB NO 20130306240A1
SERIAL NO

13952055

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Abstract

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A system and method for controlling plasma. The system includes a semiconductor chamber comprising a powered electrode, another electrode, and an adjustable coupling to ground circuit. The powered electrode is configured to receive a wafer or substrate. There is at least one grounded electrode configured to generate an electrical connection with the powered electrode. At least one of the grounded electrodes is electrically coupled to the adjustable coupling to ground circuit. The adjustable coupling to ground circuit is configured to modify the impedance of the grounded electrode. The ion energy of the plasma is controlled by the adjustable coupling to ground circuit.

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Patent Owner(s)

Patent OwnerAddress
LAM RESEARCH CORPORATIONFREMONT CA

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Collison, Wenli Fremont, US 13 300
Ni, Tuqiang Pleasanton, US 76 1426

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