Using an optically transparent solid material as a support structure for attachment of a semiconductor material to a substrate
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United States of America Patent
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Nov 17, 2015
Grant Date -
Jan 23, 2014
app pub date -
Dec 19, 2011
filing date -
Dec 19, 2011
priority date (Note) -
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Abstract
Electronic devices and methods for fabricating electronic devices are described. One method includes attaching an optically transparent solid material to a body of semiconducting material in which microelectronic devices are formed. The method also includes attaching a first surface of a body portion, comprising a portion of the body, to a substrate while a portion of the optically transparent solid material is attached to a second surface of the body portion. The method also includes removing the optically transparent solid material from the second surface of the body portion after the attaching the first surface of the body portion to the substrate.
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