Vertical conductive connections in semiconductor substrates
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United States of America Patent
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Nov 17, 2015
Grant Date -
May 21, 2015
app pub date -
Jan 20, 2015
filing date -
Jun 15, 2010
priority date (Note) -
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Abstract
An embodiment of a die comprising: a semiconductor body including a front side, a back side, and a lateral surface; an electronic device, formed in said semiconductor body and including an active area facing the front side; a vertical conductive connection, extending through the semiconductor body and defining a conductive path between the front side and the back side of the semiconductor body; and a conductive contact, defining a conductive path on the front side of the semiconductor body, between the active area and the vertical conductive connection, wherein the vertical conductive connection is formed on the lateral surface of the die, outside the active area.
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