Method of retaining a solder material to a solder terminal and the solder assembly formed thereby
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United States of America Patent
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Nov 17, 2015
Grant Date -
Jun 26, 2014
app pub date -
Dec 21, 2012
filing date -
Dec 21, 2012
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
The instant disclosure relates to a method of retaining a solder material onto a solder terminal comprising: a solder terminal and a solder material. The solder terminal includes a first surface, a second surface and a side, and is formed with a retaining hole. The solder material includes a winding portion, and a connection portion which extends on the opposite side from the winding portion of the solder material. The winding portion is arranged to cover the solder terminal along the first surface, the side and then the second surface. In addition, the connection portion is engaged with the solder terminal through the retaining hole and is bent like a hook.
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