Bonding pad for printed circuit board and semiconductor chip package using same

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United States of America Patent

PATENT NO 9192048
SERIAL NO

14310075

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Abstract

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A bonding pad for use in attaching a semiconductor chip to a printed circuit board, includes: a copper layer; an organic layer disposed over the copper layer in a pattern such that part of the copper layer is exposed; and a gold layer disposed over the organic layer and in contact with the exposed part of the copper layer.

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Patent Owner(s)

  • AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Choi, Deog Soon Seoul, KR 16 79
Choi, Yong-Ik Kyoung Ki-Do, KR 7 83
Chung, Chris Seoul, KR 30 201
Jeong, Jin Kyunggi province, KR 103 689
Lee, Young Ho Seoul, KR 105 758

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