Dynamic operations for 3D stacked memory using thermal data
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United States of America Patent
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Nov 24, 2015
Grant Date -
Oct 17, 2013
app pub date -
Sep 30, 2011
filing date -
Sep 30, 2011
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Abstract
Dynamic operations for operations for 3D stacked memory using thermal data. An embodiment of a memory device includes memory having multiple coupled memory elements and multiple thermal sensors, including a first thermal sensor in a first area of the memory stack and a second thermal sensor in a second area of the memory stack. A memory controller is to provide operations to modify thermal conditions of the memory elements based at least in part on thermal information generated by the thermal sensors.
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