Stacked device identification assignment

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United States of America Patent

PATENT NO 9196313
APP PUB NO 20150029774A1
SERIAL NO

14511794

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ATTORNEY / AGENT: (SPONSORED)

Importance

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Abstract

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Some embodiments include apparatus and methods having dice arranged in a stack. The dice include at least a first die and a second die, and a connection coupled to the dice. The connection may be configured to transfer control information to the first die during an assignment of a first identification to the first die and to transfer the control information from the first die to the second die during an assignment of a second identification to the second die.

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First Claim

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Patent Owner(s)

  • MICRON TECHNOLOGY, INC.

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Keeth, Brent Boise, US 345 10329

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