Electronic component module
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United States of America Patent
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Nov 24, 2015
Grant Date -
May 1, 2014
app pub date -
Oct 25, 2013
filing date -
Oct 30, 2012
priority date (Note) -
In Force
status (Latency Note)
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Abstract
An electronic component module includes: a multi-layered wiring board formed by stacking insulating layers, an inner wiring layer formed between the insulating layers, and a surface wiring layer formed on an outermost insulating layer of the insulating layers; and an acoustic wave device located inside the multi-layered wiring board, wherein the acoustic wave device includes a functional element and a sealing portion, the functional element being located on a substrate and exciting an acoustic wave, and the sealing portion sealing the functional element so as to form an air-space above the functional element, and a terminal portion of the surface wiring layer does not overlap the air-space of the acoustic wave device as viewed from a stacking direction of the multi-layered wiring board, the terminal portion being a region to which a terminal of an electronic component is fixed in the surface wiring layer.
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