Non-cylindrical conducting shapes in multilayer laminated substrate cores

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United States of America Patent

PATENT NO 9198293
APP PUB NO 20140197545A1
SERIAL NO

13743252

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Abstract

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Non-cylindrical conducting shapes are described in the context of multilayer laminated substrate cores. In one example a package substrate core includes a plurality of dielectric layers pressed together to form a multilayer core, a conductive bottom pattern on a bottom surface of the multilayer core, and a conductive top pattern on a top surface of the multilayer core. At least one elongated via extends through each layer of the multilayer core, each elongated via containing a conductor and each connected to a conductor of a via in an adjacent layer to electrically connect the top pattern and the bottom pattern through the conductors of the elongated vias.

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Patent Owner(s)

  • INTEL CORPORATION

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Chase, Harold R Mesa, US 1 28
Hlad, Mark S Chandler, US 14 118
Manusharow, Mathew J Phoenix, US 67 932
Roy, Mihir K Chandler, US 60 451

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