Binder composition for mold formation

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United States of America Patent

PATENT NO 9200140
APP PUB NO 20140336331A1
SERIAL NO

14355156

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Abstract

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Disclosed is a binder composition for mold formation including: one or more 5-position substituted furfural compounds selected from the group consisting of 5-hydroxymethylfurfural and 5-acetoxymethylfurfural; and a furfurylated urea resin. The content of the 5-position substituted furfural compound(s) in the binder composition for mold formation is preferably from 1 to 30% by weight, and the content of the furfurylated urea resin is preferably from 1 to 20% by weight.

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Patent Owner(s)

Patent OwnerAddress
KAO CORPORATION14-10 NIHONBASHI KAYABACHO 1-CHOME CHUO-KU TOKYO 103-8210

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Joke, Takashi Toyohashi, JP 4 9
Kato, Masayuki Toyohashi, JP 212 2891
Matsuo, Toshiki Toyohashi, JP 8 21

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