Closed-loop temperature equalization device having a heat releasing system structured by multiple flowpaths

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United States of America Patent

PATENT NO 9200850
SERIAL NO

13209579

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Abstract

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A closed-loop heat equalization system includes a heat gaining device installed within a natural thermal energy storage body, and a heat releasing device having multiple flowpaths, the heat gaining and releasing devices being connected by pipeline structures to form a closed-loop flowpath for a heat exchange fluid. An outwardly expanded arc-shaped structure may be included at one or more turning locations in the pipeline structures. The pipeline structures may include an operation port and sealing plug at a top corner of the closed-loop flowpath, and an auxiliary heating/cooling device or fluid pump controlled by a sensing device and an electric energy control unit.

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Patent Owner(s)

Patent OwnerAddress
YANG TAI-HERSI-HU TOWN DZAN-HWA

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Yang, Tai-Her Dzan-Hwa, TW 672 8133

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